PTL5S PVD Magnetron Sputtering System / Machine

Plasma Technology Limited PTL develops different con-focal, sputter tools with rotating substrates and tilting magnetron sputter sources as well as power control units.  Those developments yielded extremely uniform and controllable depositions of single layers, multi-layers and alloys and have become the most popular R&D sputtering system configuration on the market. PTL can design the PVD system to deliver maximum performance for limited budgets.

The systems inherit many design features and common parts from the highly evolved PTL sputtering tools. Typically, our PVD systems feature a number of fixed angle sources (2") on the cluster flanges for con-focal sputtering and can be fitted with rotary and heating stage to accommodate substrate up to 4" in diameter.

Our magnetron sputtering sources (2" target sizes) are designed specifically to fit cluster flanges for the compact PVD Systems. The basic magnetron and cathode assembly is identical to the unique modular magnetrons. The magnet array can be configured by the customer to operate in the balanced, unbalanced and magnetic material modes. Due to the compact design, the complete shutter and ground shield with isolation chimney assembly is quickly removed with only three screws for easy target access.

The con-focal PVD systems utilize motorized, rotating substrate holders to achieve excellent uniformity, allow the co-deposition of alloy films and facilitate the deposition of pristine, ultra-thin film multilayers since the substrate is always "in the plasma". Substrate heaters are available to reach up to 850 degree C and feature reactive gas injection rings, RF/DC bias capability, in-situ manual substrate height adjustment upto 50mm.