Sputtering Targets S-Z
We offer pure elements, compounds, alloys, ceramics, intermetallics, and mixtures with high purities and quality for R&D and Production applications. Products are widely used in electronics, semiconductor, flat panel display, magneto-optical recording medium, solar photovoltaic and functional coating etc.
We also provide in-house sputter target bonding services by either standard and custom backing plate or copper foil bonding.
If the materials you are seeking are not listed, please email us your requirements as custom projects are our specialty.
Target Name Purity
Sb 99.95%
Sb2Se3 99.999%
Sb2Te3 99.999%
Sc 99.95%
Se 99.99%
Si 99.999%
SiGe 99.99%
Si3N4 99.95%
SiC 99.99%
SiCr 99.95%
SiO 99.99%
SiO2 99.995%
Sm 99.99%
Sm2O3 99.99%
SmNiO3 99.95%
Sn 99.99%
SnTe 99.999%
SnO2 99.99%
SnTiO3 99.95%
SnZn 99.95%
Sr 99.99%
SrO 99.99%
SrRuO3 99.99%
SrTiO3 99.999%
Ta 99.99%
Ta2O5 99.99%
TaC 99.99%
TaN 99.99%
TaSi2 99.99%
Tb 99.99%
Tb2O3 99.99%
Tb4O7 99.99%
Te 99.99%
Ti 99.99%
Ti2O3 99.99%
TiAl 99.99%
TiB2 99.99%
TiC 99.99%
TiN 99.95%
TiNTiO2 99.95%
TiO 99.95%
TiO2 99.95%
TiO2Fe 99.95%
TiO2Nb 99.95%
TiSi2 99.999%
TiW 99.99%
V 99.99%
V2O3 99.99%
V2O5 99.99%
VC 99.99%
VN 99.99%
VO2 99.99%
VO5 99.95%
W 99.99%
WTi 99.95%
WC 99.99%
WO3 99.99%
WSi2 99.95%
Y 99.99%
Y2O3 99.99%
Yb 99.99%
Yb2O3 99.95%
YBa2Cu3O7 99.95%
YBCO 99.95%
YIG 99.999%
YSZ 99.95%
Zn 99.99%
ZnAl 99.95%
ZnCo 99.95%
ZnMgO2 99.95%
ZnO 99.95%
ZnOGa 99.95%
ZnOGa2O3 99.95%
ZnOSnO2 99.95%
ZnS 99.9%
ZnSCdS 99.95%
ZnSe 99.99%
ZnTe 99.999%
Zr 99.99%
ZrB2 99.95%
ZrC 99.95%
ZrN 99.95%
ZrO2 99.99%
ZrO2Y2O3 99.95%
ZTO 99.95%
ZTSO 99.95%
Bonding is recommended for ceramic materials. Many ceramic materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. A low thermal conductive target is susceptible to thermal shock and target crack may occur during sputtering process. Bonded targets can usually continue to be used even after a target crack occurs. Besides, the bonded ceramic targets can be cooled more efficiently as thinner target can transfer heat faster to the copper backing plate for heat dissipation. Usually, the thickness of the target is reduced to half when it is bonded to a backing plate and the copper backing plate comprises the other half of the thickness.
Need help?
Contact an Material Specialist by sending an Email to PTL or call 852-98814818.
Download Sputtering Targets Leaflet
Sputtering Targets A-E
Sputtering Targets F-L
Sputtering Targets M-R
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