Sputtering Targets F-L

Target Name                                Purity

Fe                                                     99.99% 

FeMn                                               99.95%

FePt                                                 99.95%

Fe20Ni80                                        99.95%

Fe2O3                                             99.95%

Fe2Si                                               99.95%

Fe3O4                                             99.95%

FeMn                                               99.95%

FeAl                                                99.95%

FeCo                                                99.9%

FeCoSiB                                          99.95%

FeHf                                                99.95%

FePO4                                             99.95%

FePt                                                 99.95%

Ga                                                    99.99%

Ga2O3                                             99.95%

GaN                                                 99.99%

GaTi                                                99.95%

Gd                                                    99.99%

Gd2O3                                             99.95%

GDC                                                99.95%

Ge                                                    99.999%

GeCr                                                99.95%

GeO2                                               99.95%

GeSb                                                99.99%

GeSe2                                              99.95%

GIZO                                               99.95%

GZO                                                99.99%

Hf                                                    99.99%

HfO2                                               99.95% 

Ho                                                   99.95%

Ho2O3                                            99.95%

IGZO                                               99.95%

In                                                     99.999% 

In2O3                                              99.95% 

Ir                                                      99.99% 

IrMn                                                99.95%

IrO2                                                 99.95%

ITO                                                  99.99%

IZO                                                  99.95%

La                                                    99.99%

LaO7SrO3MnO3                            99.95%

La2O3                                             99.95% 

LaB6                                               99.99% 

LaF3                                                99.99%

LaGaO3                                          99.95%

LaNiO3                                           99.95%

Li2O                                                99.95%

LiNiVO4                                      99.95%

Li3PO4                                            99.95%

Li4Ti5O12                                       99.95%

LiCoO2                                            99.99% 

LiF                                                   99.99% 

LiFePO4                                          99.95% 

LiMn2O4                                         99.95%

LiNiO2                                            99.95%

LSCF                                               99.99%

Bonding is recommended for ceramic materials. Many ceramic materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. A low thermal conductive target is susceptible to thermal shock and target crack may occur during sputtering process. Bonded targets can usually continue to be used even after a target crack occurs. Besides, the bonded ceramic targets can be cooled more efficiently as thinner target can transfer heat faster to the copper backing plate for heat dissipation. Usually, the thickness of the target is reduced to half when it is bonded to a backing plate and the copper backing plate comprises the other half of the thickness.

Sputtering Targets A-E

Sputtering Targets M-R

Sputtering Targets S-Z